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- Bridge diode modules
Bridge diode modules
▼MG073
Volume by approximately 50%
800V/100A single-phase diode modules
▼MG038
world's first! Thin package contributes to more freedom in design
▼MG060/MG061
A wide lineup with high IFSM tolerance!
Thin package contributes to device downsizing
■800V/100A single-phase diode modules
■Miniaturization/low-profile package
■Volume reduced by approximately 50% compared to competitor products※1
■Weight reduced by approximately 50% compared to competitor products※1
■Mounting area reduced by approximately 10% compared to competitor products※1
■UL1557 certification pending
Still under development so contents and specifications are subject to change.
■Miniaturization/low-profile package
■Volume reduced by approximately 50% compared to competitor products※1
■Weight reduced by approximately 50% compared to competitor products※1
■Mounting area reduced by approximately 10% compared to competitor products※1
■UL1557 certification pending
※1 According to internal study
Mounting area reduced by approximately 10%
Mounting area reduced by approximately 10% compared to competitor products.These features can contribute to equipment downsizing.
Weight reduced by approximately 50%
Weight reduced by approximately 50% compared to competitor products.These features can contribute to weight reduced .
Volume reduced by approximately 50%
Volume reduced by approximately 50% compared to competitor products.These features can contribute to equipment downsizing.
Product Specifications
Part Name | Absolute Maximum Ratings | Electrical Characteristics | |||||||
---|---|---|---|---|---|---|---|---|---|
VRRM [V] | VRSM [V] | IF typ. [A] | IFSM [A] | Tj [°C] | VF※2 [V] | IR [μA] | Rth(j-c) [°C/W] | ||
MG073A | 800 | 900 | 100 | TBD | 150 | 1.17 | 10 | 1.17 |
※2 IF=50[A]
■Large capacity three phase bridge diode modules
■Input and output are laid out opposite each other
■Thin package contributes to device downsizing
■No insulating required (2.5kV / 1minute)
■High heat dissipation
■Input and output are laid out opposite each other
■Thin package contributes to device downsizing
■No insulating required (2.5kV / 1minute)
■High heat dissipation
world's first!Thin package contributes to more freedom in design
world's first!Features opposing separated input and output in a thin package which contributes to more freedom in design.
External Dimensions
Equivalent Circuit
Product Specifications
Part Name | IF typ. [A] | VF [°C] | VRRM [V] | Composition |
---|---|---|---|---|
MG038A200080A | 200 | 1.05 | 800 | Three phase |
MG038B150080A | 150 | 1.05 | 800 | Three phase |
MG038C200160A | 200 | 1.20 | 1600 | Three phase |
MG038D150160A | 150 | 1.20 | 1600 | Three phase |
■Large capacity three phase bridge diode modules
■High heat dissipation
■Thin package contributes to device downsizing
■No insulating required. (2.5kV/1minute)
■High heat dissipation
■Thin package contributes to device downsizing
■No insulating required. (2.5kV/1minute)
External Dimensions
External Dimensions(MG060)
External Dimensions(MG061)
Part Name | IF typ. [A] | VF [°C] | VRRM [V] | Composition |
---|---|---|---|---|
MG060B | 75 | 1.05 | 800 | Three phase |
MG060C | 100 | 1.05 | 800 | Three phase |
MG061B | 150 | 1.05 | 800 | Three phase |
MG061C | 200 | 1.05 | 800 | Three phase |
MG060E | 75 | 1.05 | 1600 | Three phase |
MG061D | 100 | 1.05 | 1600 | Three phase |
MG061E | 150 | 1.05 | 1600 | Three phase |
MG061F | 200 | 1.05 | 1600 | Three phase |